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Established in 2020, Draking Semiconductor was jointly founded by the core team of a leading Chinese semiconductor listed company and core technical personnel from world-leading companies.
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The company has assembled a strong R&D and process team, continuously improving in aspects such as diamond powder material selection and dispersion, electroplating technology, precision processing technology, and adhesive formulation.
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Draking Semiconductor Technology can perform dicing on chips such as IGBT chips, SiC chips, lithium tantalate/lithium niobate chips, integrated circuit IC chips, and double-bonded chips, as well as on packages such as QFN and DFN, and ceramic and glass substrates.
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Product Center
Electroformed Bond Hub Blades (hard blade)
Technical Specifications
Product Performance
Processing Materials· Silicon: Bare silicon wafers, back-silver wafers, etc. · Compound semiconductors: Lithium tantalate/niobate, red/yellow gallium arsenide, gallium nitride, silicon carbide, etc. · Other materials: MOSFETs, double-bonded chips, diodes, Schottky diodes, etc. |
Compatible Equipment· Leading international equipment such as DISCO and TSK; Domestic equipment from companies such as Guangli Technology, Heyan Technology, Jingchuang Advanced, and CETC. · 12-inch, 8-inch, 6-inch, 5-inch, and 4-inch equipment. |
Product Performance· Can more accurately meet the diverse processing needs of users. · Shortens pre-cutting time and uses technology to reduce wafer deformation and breakage. · Provides new cutting blades with high processing quality (good chipping performance on both front and back sides). |
Capacity, Pre-sales and After-sales· Current monthly capacity is 20,000 pieces, and it is continuously expanding. · Owns high-end dicing equipment such as DISCO 6362, 6340, and 3240 to simulate customer production environments and provide customers with reasonable cutting process solutions. · Short delivery cycle, 24-hour customer response for exception handling. |